Lapping & Polishing System – Logitech PM6
Logitech Ltd
The UniTemp RTP-150-HV is a furnace for rapid annealing processes under high vacuum for wafers up to 6″ (150 mm). It is very compact in size, designed for applications in R&D. The RTP-150-HV can be used with standard process gases (Nitrogen, Oxygen, Forming Gas); Nitrogen is also used for cooling the substrate. The heating is made by 24 infrared lamps, for a total power of 21 kW. A 7″ touch panel allows easy programming and process control.