Dicing Saw – Disco DAD341

Details

Manufacturer
Disco
Website
https://www.disco.co.jp/
Contact person
Stefano Bigoni, Gianluca Cannetti
Location
Back End

Description:

The Disco DAD341 dicing saw allows to cut silicon, glass, and ceramic workpieces with a high degree of accuracy. The system can accomodate substrates up to 4 mm thick and supports sizes up to 8″ (203 mm). Dicing of the full wafer can be accomplished automatically while custom cuts can be performed in semi-automatic mode. Operation of the machine is staff-only.

Specifications

  • Maximum workpiece size: 8″
  • Maximum substrate thickness: 4 mm
  • Measurement resolution: 0.1 µm
  • Positioning accuracy: 0.5 µm
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